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Semikron Danfoss Standard Photo MiniSKiiP II 3

25241239M25

SKiiP 38GAL12E4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)300 A
Spannung1200 V
TopologieChopper/Booster
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 38GAL12E4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-38gal12e4v1-m01-25241239m01">SKiiP 38GAL12E4V1-M01</a><a href="/de-de/products/p/skiip-38gal12e4v1-m15-25241239m15">SKiiP 38GAL12E4V1-M15</a><a href="/de-de/products/p/skiip-38gal12e4v1-m20-25241239m20">SKiiP 38GAL12E4V1-M20</a><a href="/de-de/products/p/skiip-38gal12e4v1-m25-25241239m25">SKiiP 38GAL12E4V1-M25</a>