Semikron Danfoss logo

25232760M05

SKiiP 38AC176V2-M05

MiniSKiiP II 3, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)100 A
Spannung1700 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SKiiP 38AC176V2-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-38ac176v2-m00-25232760m00">SKiiP 38AC176V2-M00</a><a href="/de-de/products/p/skiip-38ac176v2-m05-25232760m05">SKiiP 38AC176V2-M05</a><a href="/de-de/products/p/skiip-38ac176v2-m15-25232760m15">SKiiP 38AC176V2-M15</a><a href="/de-de/products/p/skiip-38ac176v2-m20-25232760m20">SKiiP 38AC176V2-M20</a><a href="/de-de/products/p/skiip-38ac176v2-m21-25232760m21">SKiiP 38AC176V2-M21</a><a href="/de-de/products/p/skiip-38ac176v2-m25-25232760m25">SKiiP 38AC176V2-M25</a>