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Semikron Danfoss Standard Photo MiniSKiiP II 3

25238040M15

SKiiP 37NAS12F4V2-M15

MiniSKiiP II 3, Slim lid and HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)40 A
Spannung1200 V
TopologieCustomer Specific
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 37NAS12F4V2-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-37nas12f4v2-m01-25238040m01">SKiiP 37NAS12F4V2-M01</a><a href="/de-de/products/p/skiip-37nas12f4v2-m15-25238040m15">SKiiP 37NAS12F4V2-M15</a><a href="/de-de/products/p/skiip-37nas12f4v2-m20-25238040m20">SKiiP 37NAS12F4V2-M20</a><a href="/de-de/products/p/skiip-37nas12f4v2-m25-25238040m25">SKiiP 37NAS12F4V2-M25</a>