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Semikron Danfoss Standard Photo MiniSKiiP II 3

25238040M15

SKiiP 37NAS12F4V2-M15

MiniSKiiP II 3, Slim lid and HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)40 A
TechnologieIGBT
TopologieCustomer Specific
TypeMiniSKiiP II 3
Variant DescriptionThe SKiiP 37NAS12F4V2-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
VarianteSlim lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Vorschlag 65Cancer and Reproductive Harm