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25238040M01

SKiiP 37NAS12F4V2-M01

MiniSKiiP II 3, Wacker P12

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)40 A
Spannung1200 V
TopologieCustomer Specific
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 37NAS12F4V2-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/de-de/products/p/skiip-37nas12f4v2-m01-25238040m01">SKiiP 37NAS12F4V2-M01</a><a href="/de-de/products/p/skiip-37nas12f4v2-m15-25238040m15">SKiiP 37NAS12F4V2-M15</a><a href="/de-de/products/p/skiip-37nas12f4v2-m20-25238040m20">SKiiP 37NAS12F4V2-M20</a><a href="/de-de/products/p/skiip-37nas12f4v2-m25-25238040m25">SKiiP 37NAS12F4V2-M25</a>