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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231480M11

SKiiP 37AC12T4V1-M11

MiniSKiiP II 3, Slim lid and Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)75 A
TechnologieIGBT
TopologieSixpack
TypMiniSKiiP II 3
Typische AnwendungsgebieteInverter up to 36 kVATypical motor power 22 kW
VarianteSlim lid and Wacker P12
Varianten BeschreibungThe SKiiP 37AC12T4V1-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness.
Varianten KurzbeschreibungModule + Slim Pressure Lid + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm