Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 3

25233020M01

SKiiP 37AC12F4V1-M01

MiniSKiiP II 3, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaGermany
Stromstärke (A)75 A
Spannung1200 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenIGBT4 FastRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 37AC12F4V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/de-de/products/p/skiip-37ac12f4v1-m01-25233020m01">SKiiP 37AC12F4V1-M01</a><a href="/de-de/products/p/skiip-37ac12f4v1-m20-25233020m20">SKiiP 37AC12F4V1-M20</a><a href="/de-de/products/p/skiip-37ac12f4v1-m25-25233020m25">SKiiP 37AC12F4V1-M25</a>