25231470M05
SKiiP 35NAB12T4V1-M05
MiniSKiiP II 3, HPTP
25231470M05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 82x59x16 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Gehäuse | MiniSKiiP II 3 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 50 A |
| Technologie | IGBT |
| Topologie | CIB |
| Typ | MiniSKiiP II 3 |
| Typische Anwendungsgebiete | Inverter up to 26 kVATypical motor power 15 kW |
| Variante | HPTP |
| Varianten Beschreibung | The SKiiP 35NAB12T4V1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.1 Kilogramm |
| Nettogewicht | 0.082 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |