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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231740M25

SKiiP 35ACC12F4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)50 A
TechnologieIGBT
TopologieTwelvepack
TypMiniSKiiP II 3
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 35ACC12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm