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Semikron Danfoss Standard Photo MiniSKiiP II 2

25232830M25

SKiiP 29TMLI12F4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsTrench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)150 A
TechnologieIGBT
Topologie3-Level
TypMiniSKiiP II 2
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 29TMLI12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm