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Semikron Danfoss Standard Photo MiniSKiiP II 2

25232830M15

SKiiP 29TMLI12F4V1-M15

MiniSKiiP II 2, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)150 A
Spannung1200 V
Topologie3-Level
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsTrench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 29TMLI12F4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-29tmli12f4v1-m00-25232830m00">SKiiP 29TMLI12F4V1-M00</a><a href="/de-de/products/p/skiip-29tmli12f4v1-m15-25232830m15">SKiiP 29TMLI12F4V1-M15</a><a href="/de-de/products/p/skiip-29tmli12f4v1-m20-25232830m20">SKiiP 29TMLI12F4V1-M20</a><a href="/de-de/products/p/skiip-29tmli12f4v1-m21-25232830m21">SKiiP 29TMLI12F4V1-M21</a><a href="/de-de/products/p/skiip-29tmli12f4v1-m25-25232830m25">SKiiP 29TMLI12F4V1-M25</a>