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Semikron Danfoss Standard Photo MiniSKiiP II 2

25231350M25

SKiiP 28ANB16V10-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
EigenschaftenFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532UL recognised temperature sensor: file no. E257829
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1600 V
Stoßstrom (A)1000 A
Stromstärke (A)83 A
TechnologieBridge
TopologieRectifier
TypMiniSKiiP II 2
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 28ANB16V10-M25 is a 1600 V Bridge module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm