25231350M25
SKiiP 28ANB16V10-M25
MiniSKiiP II 2, Standard lid and HPTP
25231350M25
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 59x52x16 |
| Eigenschaften | Fast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532UL recognised temperature sensor: file no. E257829 |
| Gehäuse | MiniSKiiP II 2 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1600 V |
| Stoßstrom (A) | 1000 A |
| Stromstärke (A) | 83 A |
| Technologie | Bridge |
| Topologie | Rectifier |
| Type | MiniSKiiP II 2 |
| Variant Description | The SKiiP 28ANB16V10-M25 is a 1600 V Bridge module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Variante | Standard lid and HPTP |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.06 Kilogramm |
| Nettogewicht | 0.055 Kilogramm |
| Vorschlag 65 | Cancer and Reproductive Harm |