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Semikron Danfoss Standard Photo MiniSKiiP II 2

25232070M25

SKiiP 27AC12T7V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaGermany
Stromstärke (A)75 A
Spannung1200 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT T7
Eigenschaften1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.07 Kilogramm
Nettogewicht0.065 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 27AC12T7V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-27ac12t7v1-m01-25232070m01">SKiiP 27AC12T7V1-M01</a><a href="/de-de/products/p/skiip-27ac12t7v1-m05-25232070m05">SKiiP 27AC12T7V1-M05</a><a href="/de-de/products/p/skiip-27ac12t7v1-m15-25232070m15">SKiiP 27AC12T7V1-M15</a><a href="/de-de/products/p/skiip-27ac12t7v1-m20-25232070m20">SKiiP 27AC12T7V1-M20</a><a href="/de-de/products/p/skiip-27ac12t7v1-m25-25232070m25">SKiiP 27AC12T7V1-M25</a>