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Semikron Danfoss Standard Photo MiniSKiiP II 2

25230630M25

SKiiP 26NAB066V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)50 A
TechnologieIGBT
TopologieCIB
TypMiniSKiiP II 2
Typische AnwendungsgebieteInverter up to 12,5 kVATypical motor power 5,5 kW
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 26NAB066V1-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm