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25232800M01

SKiiP 26MLI07E3V1-M01

MiniSKiiP II 2, Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT 3 (Trench)
Eigenschaften650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung650 V
Stromstärke (A)75 A
TechnologieIGBT
Topologie3-Level
TypMiniSKiiP II 2
Typische AnwendungsgebieteUninterruptible power supplies (UPS)Solar inverters
VarianteWacker P12
Varianten BeschreibungThe SKiiP 26MLI07E3V1-M01 is a 650 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm