
25232570M11
SKiiP 26GH12T4V11-M11
MiniSKiiP II 2, Slim lid and Wacker P12
25232570M11
Produktdaten
Eigenschaften | Wert |
|---|---|
| Produktstatus | In Production |
| Herkunftsland | Germany |
| Stromstärke (A) | 70 A |
| Spannung | 1200 V |
| Topologie | H-Bridge |
| Produktlinie | MiniSKiiP |
| Gehäuse | MiniSKiiP II 2 |
| Abmessungen (LxBxH) | 59x52x16 |
| Technologie | IGBT |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Typische Anwendungsgebiete | Single phase inverter |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.06 Kilogramm |
| Nettogewicht | 0.055 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
Eigenschaften | Wert |
|---|---|
| Variante | Slim lid and Wacker P12 |
| Varianten Beschreibung | The SKiiP 26GH12T4V11-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Varianten Kurzbeschreibung | Module + Slim Pressure Lid + Thermal Paste Wacker P12 |
| Variants | <a href="/de-de/products/p/skiip-26gh12t4v11-m00-25232570m00">SKiiP 26GH12T4V11-M00</a><a href="/de-de/products/p/skiip-26gh12t4v11-m01-25232570m01">SKiiP 26GH12T4V11-M01</a><a href="/de-de/products/p/skiip-26gh12t4v11-m10-25232570m10">SKiiP 26GH12T4V11-M10</a><a href="/de-de/products/p/skiip-26gh12t4v11-m11-25232570m11">SKiiP 26GH12T4V11-M11</a><a href="/de-de/products/p/skiip-26gh12t4v11-m20-25232570m20">SKiiP 26GH12T4V11-M20</a><a href="/de-de/products/p/skiip-26gh12t4v11-m21-25232570m21">SKiiP 26GH12T4V11-M21</a><a href="/de-de/products/p/skiip-26gh12t4v11-m25-25232570m25">SKiiP 26GH12T4V11-M25</a> |