25232570M01
SKiiP 26GH12T4V11-M01
MiniSKiiP II 2, Wacker P12
25232570M01
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 59x52x16 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Gehäuse | MiniSKiiP II 2 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 70 A |
| Technologie | IGBT |
| Topologie | H-Bridge |
| Typ | MiniSKiiP II 2 |
| Typische Anwendungsgebiete | Single phase inverter |
| Variante | Wacker P12 |
| Varianten Beschreibung | The SKiiP 26GH12T4V11-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Varianten Kurzbeschreibung | Module + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.06 Kilogramm |
| Nettogewicht | 0.055 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |