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Semikron Danfoss Standard Photo MiniSKiiP II 2 GB

25240715M25

SKiiP 26GB07E3V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)200 A
Spannung650 V
TopologieHalf-Bridge
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
Eigenschaften650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 26GB07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-26gb07e3v1-m00-25240715m00">SKiiP 26GB07E3V1-M00</a><a href="/de-de/products/p/skiip-26gb07e3v1-m01-25240715m01">SKiiP 26GB07E3V1-M01</a><a href="/de-de/products/p/skiip-26gb07e3v1-m10-25240715m10">SKiiP 26GB07E3V1-M10</a><a href="/de-de/products/p/skiip-26gb07e3v1-m11-25240715m11">SKiiP 26GB07E3V1-M11</a><a href="/de-de/products/p/skiip-26gb07e3v1-m20-25240715m20">SKiiP 26GB07E3V1-M20</a><a href="/de-de/products/p/skiip-26gb07e3v1-m21-25240715m21">SKiiP 26GB07E3V1-M21</a><a href="/de-de/products/p/skiip-26gb07e3v1-m25-25240715m25">SKiiP 26GB07E3V1-M25</a>