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25241235M25

SKiiP 26GAL12T4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)200 A
Spannung1200 V
TopologieChopper/Booster
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 26GAL12T4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-26gal12t4v1-m00-25241235m00">SKiiP 26GAL12T4V1-M00</a><a href="/de-de/products/p/skiip-26gal12t4v1-m01-25241235m01">SKiiP 26GAL12T4V1-M01</a><a href="/de-de/products/p/skiip-26gal12t4v1-m15-25241235m15">SKiiP 26GAL12T4V1-M15</a><a href="/de-de/products/p/skiip-26gal12t4v1-m20-25241235m20">SKiiP 26GAL12T4V1-M20</a><a href="/de-de/products/p/skiip-26gal12t4v1-m25-25241235m25">SKiiP 26GAL12T4V1-M25</a>