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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233350M05

SKiiP 24NAB12RAV1-M05

MiniSKiiP II 2, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandChinaSlovakiaGermany
Stromstärke (A)35 A
Spannung1200 V
TopologieCIB
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieRGA
Eigenschaften1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SKiiP 24NAB12RAV1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-24nab12rav1-m01-25233350m01">SKiiP 24NAB12RAV1-M01</a><a href="/de-de/products/p/skiip-24nab12rav1-m10-25233350m10">SKiiP 24NAB12RAV1-M10</a><a href="/de-de/products/p/skiip-24nab12rav1-m15-25233350m15">SKiiP 24NAB12RAV1-M15</a><a href="/de-de/products/p/skiip-24nab12rav1-m20-25233350m20">SKiiP 24NAB12RAV1-M20</a><a href="/de-de/products/p/skiip-24nab12rav1-m25-25233350m25">SKiiP 24NAB12RAV1-M25</a><a href="/de-de/products/p/skiip-24nab12rav1-m05-25233350m05">SKiiP 24NAB12RAV1-M05</a>