Semikron Danfoss logo

25241213M10

SKiiP 24GB12T4V1-M10

MiniSKiiP II 2, Slim lid M10

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)150 A
TechnologieIGBT
TopologieHalf-Bridge
TypMiniSKiiP II 2
VarianteSlim lid M10
Varianten BeschreibungThe SKiiP 24GB12T4V1-M10 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid for compact layouts.
Varianten KurzbeschreibungModule + Slim Pressure Lid

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm