Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 2

25231970M25

SKiiP 24ACC12T7V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandSlovakia
Stromstärke (A)35 A
Spannung1200 V
TopologieTwelvepack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT T7
Features1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.07 Kilogramm
Nettogewicht0.065 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 24ACC12T7V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-24acc12t7v1-m01-25231970m01">SKiiP 24ACC12T7V1-M01</a><a href="/de-de/products/p/skiip-24acc12t7v1-m15-25231970m15">SKiiP 24ACC12T7V1-M15</a><a href="/de-de/products/p/skiip-24acc12t7v1-m20-25231970m20">SKiiP 24ACC12T7V1-M20</a><a href="/de-de/products/p/skiip-24acc12t7v1-m25-25231970m25">SKiiP 24ACC12T7V1-M25</a>