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25231970M01

SKiiP 24ACC12T7V1-M01

MiniSKiiP II 2, Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT T7
Eigenschaften1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)35 A
TechnologieIGBT
TopologieTwelvepack
TypMiniSKiiP II 2
VarianteWacker P12
Varianten BeschreibungThe SKiiP 24ACC12T7V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.07 Kilogramm
Nettogewicht0.065 Kilogramm
Proposition 65Cancer and Reproductive Harm