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25231770M25

SKiiP 24ACC12T4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)25 A
Spannung1200 V
TopologieTwelvepack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Typische Anwendungsgebiete4Q inverters

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.07 Kilogramm
Nettogewicht0.065 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 24ACC12T4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-24acc12t4v1-m01-25231770m01">SKiiP 24ACC12T4V1-M01</a><a href="/products/p/skiip-24acc12t4v1-m15-25231770m15">SKiiP 24ACC12T4V1-M15</a><a href="/products/p/skiip-24acc12t4v1-m20-25231770m20">SKiiP 24ACC12T4V1-M20</a><a href="/products/p/skiip-24acc12t4v1-m21-25231770m21">SKiiP 24ACC12T4V1-M21</a><a href="/products/p/skiip-24acc12t4v1-m25-25231770m25">SKiiP 24ACC12T4V1-M25</a>