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25231770M01

SKiiP 24ACC12T4V1-M01

MiniSKiiP II 2, Wacker P12

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)25 A
Spannung1200 V
TopologieTwelvepack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Typische Anwendungsgebiete4Q inverters

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.07 Kilogramm
Nettogewicht0.065 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 24ACC12T4V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-24acc12t4v1-m01-25231770m01">SKiiP 24ACC12T4V1-M01</a><a href="/products/p/skiip-24acc12t4v1-m15-25231770m15">SKiiP 24ACC12T4V1-M15</a><a href="/products/p/skiip-24acc12t4v1-m20-25231770m20">SKiiP 24ACC12T4V1-M20</a><a href="/products/p/skiip-24acc12t4v1-m21-25231770m21">SKiiP 24ACC12T4V1-M21</a><a href="/products/p/skiip-24acc12t4v1-m25-25231770m25">SKiiP 24ACC12T4V1-M25</a>