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Semikron Danfoss Standard Photo MiniSKiiP II 2

25232110M25

SKiiP 23NAB12T4V2-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)25 A
Spannung1200 V
TopologieCIB
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 23NAB12T4V2-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-23nab12t4v2-m01-25232110m01">SKiiP 23NAB12T4V2-M01</a><a href="/de-de/products/p/skiip-23nab12t4v2-m10-25232110m10">SKiiP 23NAB12T4V2-M10</a><a href="/de-de/products/p/skiip-23nab12t4v2-m15-25232110m15">SKiiP 23NAB12T4V2-M15</a><a href="/de-de/products/p/skiip-23nab12t4v2-m20-25232110m20">SKiiP 23NAB12T4V2-M20</a><a href="/de-de/products/p/skiip-23nab12t4v2-m25-25232110m25">SKiiP 23NAB12T4V2-M25</a>