Semikron Danfoss logo

25231960M01

SKiiP 23ACC12T7V1-M01

MiniSKiiP II 2, Wacker P12

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)25 A
Spannung1200 V
TopologieTwelvepack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieIGBT T7
Eigenschaften1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.07 Kilogramm
Nettogewicht0.065 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 23ACC12T7V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/de-de/products/p/skiip-23acc12t7v1-m01-25231960m01">SKiiP 23ACC12T7V1-M01</a><a href="/de-de/products/p/skiip-23acc12t7v1-m10-25231960m10">SKiiP 23ACC12T7V1-M10</a><a href="/de-de/products/p/skiip-23acc12t7v1-m15-25231960m15">SKiiP 23ACC12T7V1-M15</a><a href="/de-de/products/p/skiip-23acc12t7v1-m20-25231960m20">SKiiP 23ACC12T7V1-M20</a><a href="/de-de/products/p/skiip-23acc12t7v1-m25-25231960m25">SKiiP 23ACC12T7V1-M25</a>