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Semikron Danfoss Standard Photo MiniSKiiP II 1

25231200M11

SKiiP 12NAB126V20-M11

MiniSKiiP II 1, Slim lid and Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)42x40x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenFast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 1
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)15 A
TechnologieIGBT
TopologieCIB
TypMiniSKiiP II 1
VarianteSlim lid and Wacker P12
Varianten BeschreibungThe SKiiP 12NAB126V20-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Slim Pressure Lid + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm