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Semikron Danfoss Standard Photo MiniSKiiP II 1

25230840M01

SKiiP 12HEB066V1-M01

MiniSKiiP II 1, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandGermany
Stromstärke (A)15 A
Spannung600 V
TopologieCIB
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 1
Abmessungen (LxBxH)42x40x16
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 12HEB066V1-M01 is a 600 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-12heb066v1-m00-25230840m00">SKiiP 12HEB066V1-M00</a><a href="/products/p/skiip-12heb066v1-m10-25230840m10">SKiiP 12HEB066V1-M10</a><a href="/products/p/skiip-12heb066v1-m20-25230840m20">SKiiP 12HEB066V1-M20</a><a href="/products/p/skiip-12heb066v1-m01-25230840m01">SKiiP 12HEB066V1-M01</a><a href="/products/p/skiip-12heb066v1-m11-25230840m11">SKiiP 12HEB066V1-M11</a><a href="/products/p/skiip-12heb066v1-m15-25230840m15">SKiiP 12HEB066V1-M15</a><a href="/products/p/skiip-12heb066v1-m21-25230840m21">SKiiP 12HEB066V1-M21</a>