Semikron Danfoss logo

25230900M21

SKiiP 11AC126V10-M21

MiniSKiiP II 1, Standard lid and Wacker P12

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandGermany
Stromstärke (A)6 A
Spannung1200 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 1
Abmessungen (LxBxH)42x40x16
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
EigenschaftenFast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and Wacker P12
Varianten BeschreibungThe SKiiP 11AC126V10-M21 is a 1200 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK).
Varianten KurzbeschreibungModule + Standard Pressure Lid + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-11ac126v10-m00-25230900m00">SKiiP 11AC126V10-M00</a><a href="/products/p/skiip-11ac126v10-m01-25230900m01">SKiiP 11AC126V10-M01</a><a href="/products/p/skiip-11ac126v10-m10-25230900m10">SKiiP 11AC126V10-M10</a><a href="/products/p/skiip-11ac126v10-m11-25230900m11">SKiiP 11AC126V10-M11</a><a href="/products/p/skiip-11ac126v10-m20-25230900m20">SKiiP 11AC126V10-M20</a><a href="/products/p/skiip-11ac126v10-m21-25230900m21">SKiiP 11AC126V10-M21</a>