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Semikron Danfoss Standard Photo MiniSKiiP II 0

25232540M15

SKiiP 03NAC12T4V1-M15

MiniSKiiP II 0, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandGermany
Stromstärke (A)8 A
Spannung1200 V
TopologieCI
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 0
Abmessungen (LxBxH)34x31x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.023 Kilogramm
Nettogewicht0.02 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 03NAC12T4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-03nac12t4v1-m21-25232540m21">SKiiP 03NAC12T4V1-M21</a><a href="/de-de/products/p/skiip-03nac12t4v1-m25-25232540m25">SKiiP 03NAC12T4V1-M25</a><a href="/de-de/products/p/skiip-03nac12t4v1-m00-25232540m00">SKiiP 03NAC12T4V1-M00</a><a href="/de-de/products/p/skiip-03nac12t4v1-m01-25232540m01">SKiiP 03NAC12T4V1-M01</a><a href="/de-de/products/p/skiip-03nac12t4v1-m10-25232540m10">SKiiP 03NAC12T4V1-M10</a><a href="/de-de/products/p/skiip-03nac12t4v1-m11-25232540m11">SKiiP 03NAC12T4V1-M11</a><a href="/de-de/products/p/skiip-03nac12t4v1-m15-25232540m15">SKiiP 03NAC12T4V1-M15</a><a href="/de-de/products/p/skiip-03nac12t4v1-m20-25232540m20">SKiiP 03NAC12T4V1-M20</a>