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Semikron Danfoss Standard Photo MiniSKiiP II 0

25232540M15

SKiiP 03NAC12T4V1-M15

MiniSKiiP II 0, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)34x31x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 0
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)8 A
TechnologieIGBT
TopologieCI
TypMiniSKiiP II 0
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 03NAC12T4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.023 Kilogramm
Nettogewicht0.02 Kilogramm
Proposition 65Cancer and Reproductive Harm