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24921430VM05

SK75MLI07S5TD1E1-M05

SEMITOP E1, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x34x12
Chip TechnologieTrench 5 (S5)
EigenschaftenOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench5 IGBT (S5/L5)Rapid switching diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E1
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production
Spannung650 V
Stromstärke (A)75 A
TechnologieIGBT
Topologie3-Level
Typische AnwendungsgebieteUPSSolar
VarianteHPTP
Varianten BeschreibungThe SK75MLI07S5TD1E1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.022 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm