24921130VM05
SK50DGDL066ETE2-M05
SEMITOP E2, HPTP
24921130VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 63x57x12 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology600V Trench IGBT3 (066)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Gehäuse | SEMITOP E2 |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | Sample Status |
| Spannung | 600 V |
| Stromstärke (A) | 50 A |
| Technologie | IGBT |
| Topologie | CIB |
| Typische Anwendungsgebiete | Motor drivesAir conditioningAuxiliary Inverters |
| Variante | HPTP |
| Varianten Beschreibung | The SK50DGDL066ETE2-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.055 Kilogramm |
| Nettogewicht | 0.035 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |