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24922560VM07

SK35DGDL12T7ETE2s-M07

SEMITOP E2 Solder, HP-PCM

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandItaly
Stromstärke (A)35 A
Spannung1200 V
TopologieCIB
ProduktlinieSEMITOP
GehäuseSEMITOP E2 Solder
Abmessungen (LxBxH)63x57x12
TechnologieIGBT
Chip TechnologieIGBT T7
EigenschaftenOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHP-PCM
Varianten BeschreibungThe SK35DGDL12T7ETE2s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a phase change material and offers superior thermal performance, which maximizes the module's power output or significantly increases its lifetime. The material is solid at room temperature and starts to flow only after very first operation, spread out and fill the gaps between module and cooler.
Varianten KurzbeschreibungModule + High Performance Phase Change Material (HP-PCM)
Variants<a href="/products/p/sk35dgdl12t7ete2s-m07-24922560vm07">SK35DGDL12T7ETE2s-M07</a><a href="/products/p/sk35dgdl12t7ete2s-m05-24922560vm05">SK35DGDL12T7ETE2s-M05</a><a href="/products/p/sk35dgdl12t7ete2s-24922560">SK35DGDL12T7ETE2s</a>