Semikron Danfoss logo

24923290VM07

SK35DGD12T7ETE2s-M07

SEMITOP E2 Solder, HP-PCM

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)63x57x12
Chip TechnologieIGBT T7
EigenschaftenOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
GehäuseSEMITOP E2 Solder
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)35 A
TechnologieIGBT
TopologieCI
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters
VarianteHP-PCM
Varianten BeschreibungThe SK35DGD12T7ETE2s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Varianten KurzbeschreibungModule + High Performance Phase Change Material (HP-PCM)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Proposition 65Cancer and Reproductive Harm