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230B9715

SK300MB120RM04TE2-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandItaly
Stromstärke (A)266 A
Spannung1200 V
TopologieHalf-Bridge
ProduktlinieSEMITOP
GehäuseSEMITOP E2
Abmessungen (LxBxH)63x57x12
TechnologieSiC MOSFET
Chip TechnologieGen 4 SiC MOSFET (RM)
FeaturesOptimized design for superior thermal performanceLow inductance designPress-Fit contact technology1200V Trench Gen4 SiC MOSFETUnipolar gate controlOptimized switching stability thanks to module integrated gate resistorsIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typische AnwendungsgebieteSwitched Mode Power SuppliesEnergy Storage SystemsElectric Vehicle chargingUPSSolar

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.058 Kilogramm
Nettogewicht0.038 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK300MB120RM04TE2-M05 is a 1200 V SiC MOSFET module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/sk300mb120rm04te2-24923980">SK300MB120RM04TE2</a><a href="/de-de/products/p/sk300mb120rm04te2-m05-230b9715">SK300MB120RM04TE2-M05</a><a href="/de-de/products/p/sk300mb120rm04te2-m07-230b6781">SK300MB120RM04TE2-M07</a>