24919631VM05
SK25GD12T4ETp-M05
SEMITOP 3 Press-Fit, HPTP
24919631VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 31x55x12 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | One screw mounting moduleOptimized design for superior thermal performancesLow inductive designCompatible with other SEMITOP<sup>®</sup> Press-Fit types1200V Trench IGBT (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized, file no. E 63 532 |
| Gehäuse | SEMITOP 3 Press-Fit |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production New |
| Spannung | 1200 V |
| Stromstärke (A) | 25 A |
| Technologie | IGBT |
| Topologie | Sixpack |
| Typische Anwendungsgebiete | Motor DrivesServo DrivesAir ConditioningAuxiliary InvertersUPS |
| Variante | HPTP |
| Varianten Beschreibung | The SK25GD12T4ETp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.035 Kilogramm |
| Nettogewicht | 0.026 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |