24922950VM05
SK25DGDL12T7ETE1s-M05
SEMITOP E1 Solder, HPTP
24922950VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Produktstatus | In Production New |
| Herkunftsland | Italy |
| Stromstärke (A) | 25 A |
| Spannung | 1200 V |
| Topologie | CIB |
| Produktlinie | SEMITOP |
| Gehäuse | SEMITOP E1 Solder |
| Abmessungen (LxBxH) | 63x34x12 |
| Technologie | IGBT |
| Chip Technologie | IGBT T7 |
| Eigenschaften | Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Typische Anwendungsgebiete | Motor drivesAir conditioningAuxiliary Inverters |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.022 Kilogramm |
| Nettogewicht | 0.022 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
Eigenschaften | Wert |
|---|---|
| Variante | HPTP |
| Varianten Beschreibung | The SK25DGDL12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/products/p/sk25dgdl12t7ete1s-m05-24922950vm05">SK25DGDL12T7ETE1s-M05</a><a href="/products/p/sk25dgdl12t7ete1s-m07-24922950vm07">SK25DGDL12T7ETE1s-M07</a><a href="/products/p/sk25dgdl12t7ete1s-24922950">SK25DGDL12T7ETE1s</a> |