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24922230VM05

SK25DGDL12T4ETE2V1-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandItaly
Stromstärke (A)25 A
Spannung1200 V
TopologieCIB
ProduktlinieSEMITOP
GehäuseSEMITOP E2
Abmessungen (LxBxH)63x57x12
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenOptimized design for superior thermal performancesLow inductive designPress-Fit contact technology1200V Trench IGBT4 (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK25DGDL12T4ETE2V1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk25dgdl12t4ete2v1-m05-24922230vm05">SK25DGDL12T4ETE2V1-M05</a><a href="/products/p/sk25dgdl12t4ete2v1-24922230">SK25DGDL12T4ETE2V1</a>