24919781VM01
SK25DGD12T4Tp-M01
SEMITOP 4 Press-Fit, Wacker P12
24919781VM01
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 61x55x12 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrateTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532 |
| Gehäuse | SEMITOP 4 Press-Fit |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 25 A |
| Technologie | IGBT |
| Topologie | CI |
| Typische Anwendungsgebiete | Motor drives |
| Variante | Wacker P12 |
| Varianten Beschreibung | The SK25DGD12T4Tp-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Varianten Kurzbeschreibung | Module + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.074 Kilogramm |
| Nettogewicht | 0.06 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |