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24920840VM05

SK200TMLI12F4TE2-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandItaly
Stromstärke (A)200 A
Spannung1200 V
Topologie3-Level
ProduktlinieSEMITOP
GehäuseSEMITOP E2
Abmessungen (LxBxH)63x57x12
TechnologieIGBT
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology1200V Trench IGBT4 Fast (F4)650V Trench IGBT3 (E3)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typische AnwendungsgebieteUPSSolar

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK200TMLI12F4TE2-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk200tmli12f4te2-m05-24920840vm05">SK200TMLI12F4TE2-M05</a><a href="/products/p/sk200tmli12f4te2-24920840">SK200TMLI12F4TE2</a>