24920071VM05
SK150MLI07F3TD1p-M05
SEMITOP 4 Press-Fit, HPTP
24920071VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 61x55x12 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrate650V Trench IGBT technologyCAL4F technology FWDRapid switching clamping diode technologyIntegrated NTC temperature sensorUL recognized, file no. E 63 532 |
| Gehäuse | SEMITOP 4 Press-Fit |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production |
| Spannung | 650 V |
| Stromstärke (A) | 150 A |
| Technologie | IGBT |
| Topologie | 3-Level |
| Typische Anwendungsgebiete | UPSSolar |
| Variante | HPTP |
| Varianten Beschreibung | The SK150MLI07F3TD1p-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.074 Kilogramm |
| Nettogewicht | 0.06 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |