Semikron Danfoss logo

24923210VM05

SK10DGD12T7ETE1s-M05

SEMITOP E1 Solder, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandItaly
Stromstärke (A)10 A
Spannung1200 V
TopologieCI
ProduktlinieSEMITOP
GehäuseSEMITOP E1 Solder
Abmessungen (LxBxH)63x34x12
TechnologieIGBT
Chip TechnologieIGBT T7
Typische AnwendungsgebieteMotor drivesAir conditioningAuxiliary Inverters

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.022 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK10DGD12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk10dgd12t7ete1s-m05-24923210vm05">SK10DGD12T7ETE1s-M05</a><a href="/products/p/sk10dgd12t7ete1s-m07-24923210vm07">SK10DGD12T7ETE1s-M07</a><a href="/products/p/sk10dgd12t7ete1s-24923210">SK10DGD12T7ETE1s</a>