24914760VM05
SK 75 GBB 066 T-M05
SEMITOP 3, HPTP
24914760VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 55x31x12 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor |
| Gehäuse | SEMITOP 3 |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production |
| Spannung | 600 V |
| Stromstärke (A) | 75 A |
| Technologie | IGBT |
| Topologie | H-Bridge |
| Typische Anwendungsgebiete | Switching (not for linear use)InverterSwitched mode power suppliesUPS |
| Variante | HPTP |
| Varianten Beschreibung | The SK 75 GBB 066 T-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.039 Kilogramm |
| Nettogewicht | 0.03 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |