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24910770VM05

SK 60 GB 125-M05

SEMITOP 3, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)55x31x12
Chip TechnologieNPT IGBT (Ultrafast)
EigenschaftenCompact designOne screw mountingHeat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)High short circuit capabilityUltra Fast NPT IGBT technologyV<sub>ce,sat </sub>with positive coefficient
GehäuseSEMITOP 3
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)50 A
TechnologieIGBT
TopologieHalf-Bridge
TypSEMITOP 3
Typische AnwendungsgebieteSwitching (not for linear use)InverterSwitched mode power suppliesUPS
VarianteHPTP
Varianten BeschreibungThe SK 60 GB 125-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.039 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm