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24912720VM05

SK 50 GD 066 ET-M05

SEMITOP 3, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)55x31x12
Chip TechnologieIGBT 3 (Trench)
EigenschaftenCompact designOne screw mountingHeat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL technology FWDIntegrated NTC temperature sensor
GehäuseSEMITOP 3
HerkunftslandItaly
ProduktlinieSEMITOP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)50 A
TechnologieIGBT
TopologieSixpack
Typische AnwendungsgebieteInverter up to 12,5 kVATyp. motor power 5,5 kW
VarianteHPTP
Varianten BeschreibungThe SK 50 GD 066 ET-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.039 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm