24915000VM01
SK 150 GB 066 T-M01
SEMITOP 3, Wacker P12
24915000VM01
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 55x31x12 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor |
| Gehäuse | SEMITOP 3 |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production |
| Spannung | 600 V |
| Stromstärke (A) | 150 A |
| Technologie | IGBT |
| Topologie | Half-Bridge |
| Typische Anwendungsgebiete | V<sub>isol</sub> = 3000V AC,50Hz,1s |
| Variante | Wacker P12 |
| Varianten Beschreibung | The SK 150 GB 066 T-M01 is a 600 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Varianten Kurzbeschreibung | Module + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.039 Kilogramm |
| Nettogewicht | 0.03 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |