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27895401VM07

SEMiX603GB17E4pV1-M07

SEMiX 3p, HP-PCM

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandSlovakia
Stromstärke (A)600 A
Spannung1700 V
TopologieHalf-Bridge
ProduktlinieSEMiX
GehäuseSEMiX 3p
Abmessungen (LxBxH)150x62x17
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityPress-fit pins as auxiliary contactsUL recognized, file no. E63532
Typische AnwendungsgebieteAC inverter drivesUPSRenewable energy systems

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.381 Kilogramm
Nettogewicht0.35 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHP-PCM
Varianten BeschreibungThe SEMiX603GB17E4pV1-M07 is a 1700 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Varianten KurzbeschreibungModule + High Performance Phase Change Material (HP-PCM)
Variants<a href="/de-de/products/p/semix603gb17e4pv1-m04-27895401vm04">SEMiX603GB17E4pV1-M04</a><a href="/de-de/products/p/semix603gb17e4pv1-m06-27895401vm06">SEMiX603GB17E4pV1-M06</a><a href="/de-de/products/p/semix603gb17e4pv1-m07-27895401vm07">SEMiX603GB17E4pV1-M07</a><a href="/de-de/products/p/semix603gb17e4pv1-27895401">SEMiX603GB17E4pV1</a>